At the same time as the rest of the iPhone obsessed international was on the brink of stand in line or just impatiently waiting for their pre-order to arrive, the teams at iFixit and Chipworks have been polishing their equipment like underfed lumberjacks sitting right down to a steak dinner.
each websites presented liveblogs in their iPhone 7 (and 7 Plus) teardowns and spotted some thrilling tidbits inside the system, coming across a handset that looks lots more distinct on the inner than out. but first they had to dig through an entire lot of glue – a membrane of types that seems to play a key position in the cellphone’s newfound water resistance score, along with the haptic domestic button, which additionally serves to take away a long time ache point of damaged buttons.
among different issues, the usage of glue as part of the waterproofing manner may also mean that you lose some of that characteristic while the telephone is repaired.
on the chip front, the A10 is the front and center. And there’s an entire lot of it on the floor, with a a hundred twenty five sq. mm footprint. The chip, which also bears the a long way much less memorable call APL1W24, looks to be synthetic by TSMC (Taiwan Semiconductor manufacturing enterprise), tapped in component because of its information generation, which continues the chip extraordinarily skinny.
on the unit torn apart via Chipworks (A1778), an Intel mobile cell platform is gift, together with two RF transceivers, energy control and modem. There could be Qualcomm synthetic chips on the CDMA A1660 version, because of a few CMDA licensing problems for Intel. data on that is still to come.
both Hynix and Toshiba were employed to offer garage for the brand new cellphone. As for memory, there’s 2GB on the 7 and 3GB on the 7 Plus, in keeping with the reviews.
iFixit’s file offers the handset a bit of a mixed bag at the repairability front. further to the aforementioned glue, Apple has introduced but some other screw type, bringing the desired screwdriver count number as much as 4.